Record trajectory beyond v2.5.0: Zynq FPGA next, after a "coloring in" hardening phase

The next big milestone after the three-board bare-metal cut (v2.5.0) is
transferring the battle-tested amd64/aarch64/riscv64 story to a Zynq (AMD
Xilinx) FPGA SoC — configurable silicon with soft/hard CPU cores, PL fabric,
and a non-standard memory map, a genuinely larger step than any prior board
(expected on a new even-major line). Between v2.5.0 and the Zynq sits a
"coloring in" period: hardening that thickens the shape of what exists rather
than adding silicon (USB BOT/xHCI + block robustness, live-entropy and
Zuse-cert hardening on real ASICs, SMP/multi-core + IRQ routing from the HAL
notes, driver breadth) so the FPGA carries a production-honest shape forward.

Authoritative form in ROADMAP.md "Beyond v2.5.0"; FABRIC-3.md tracks the same
horizon in the post-release section and re-points G.6's Next at the
v2.2.0/v2.4.0/v2.5.0 cadence.
This commit is contained in:
Robert Allan James
2026-08-29 10:28:22 -04:00
parent 25276ae359
commit 8e94522d10
4 changed files with 36 additions and 4 deletions
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@@ -47,6 +47,27 @@ not a separate dev line):
- **v2.5.0 — all three bare metal.** Adds Milk-V (riscv64) to the above; the Zkr (RNDR)
backend live. This is the full "same story on all three arches on real silicon" cut.
**Beyond v2.5.0 — Zynq FPGA is the next big milestone, after a hardening phase.** Once the
three general-purpose boards close, the next major transfer is to a **Zynq (AMD Xilinx)
FPGA** SoC — the step where the battle-tested amd64/aarch64/riscv64 story rides on
configurable silicon. That is a genuinely bigger milestone than any single prior board: an
FPGA demands its platform be carried forward rather than ported with trivial
architecture-delta work, and it reshapes the hardware story (soft/hard CPU cores, PL fabric,
non-standard memory map, custom peripherals). Expect a new even-major line for it once the
coloring-in period below lands.
**Before the FPGA — "coloring in", decided 2026-08-29.** The period between the all-three
bare-metal cut (v2.5.0) and starting the Zynq is finishing/hardening work that thickens the
shape of what already exists rather than adding new silicon. This is not idle time; it is
the point where v2.5.0's real-hardware story is made production-honest before the FPGA asks
to carry it further. Concrete items to define during it (draft scope, to be firmed at v2.5.0
close): Zynq-preflight robustness of the USB BOT/xHCI and block paths; live-entropy and
Zuse-cert hardening on the three real boards; SMP/multi-core bring-up and IRQ routing on real
ASICs (parked in the HAL notes); driver set expansion beyond the three boards before
committing an FPGA port; and whatever v2.5.0's real-board validation surfaces. As boards
land and the v2.5.0 gates close, this list is edited down to the concrete coloring-in punch
list, and the Zynq becomes the even-major target after it.
QEMU remains the zero-degradation reference on every line; each `X.Y.0` must reproduce the
QEMU acceptance story (`POST 1012/0/0` + `ok>`, block-fence Zuse true, backend entropy
non-deterministic) on its board before it closes.